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A3P1000-FGG256M FPGA - Field Programmable Gate Array A3P1000-FGG256M
  • A3P1000-FGG256M FPGA - Field Programmable Gate Array A3P1000-FGG256M

A3P1000-FGG256M FPGA - Field Programmable Gate Array A3P1000-FGG256M

Place of Origin Call
Brand Name Microchip Technology
Certification ROHS
Model Number A3P1000-FGG256M
Product Details
Product Name:
A3P1000-FGG256M
Condition:
Original 100%
Installation Methodpe:
FPGA Surface Mount 177 I/O -55°C ~ 125°C (TJ) 256-LBGA ProASIC3 147456 Bits 1.14 V ~ 1.575 V
Package:
256-LBGA
Voltage - Supply:
International Standard
Max. Reverse Current:
International Standard
Application:
FPGAs (Field Programmable Gate Array)
Product Description

                                                                  A3P1000-FGG256M FPGA - Field Programmable Gate Array A3P1000-FGG256M 0A3P1000-FGG256M Datasheet
Product Details

[Actel]

1 – ProASIC®3 Flash Family FPGAs with Optional Soft ARM Support

Features and Benefits

High Capacity
• 15 k to 1 M System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 300 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Live at Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI†
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced
Encryption Standard (AES) Decryption (except ARM®-
enabled ProASIC®3 devices) via JTAG (IEEE 1532–
compliant)†
• FlashLock® to Secure FPGA Contents
Low Power
• Core Voltage for Low Power
• Support for 1.5 V-Only Systems
• Low-Impedance Flash Switches
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and
LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, BLVDS, and
M-LVDS (A3P250 and above)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold Sparing I/Os‡
• Programmable Output Slew Rate† and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL†
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay
Capabilities and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory†
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit
RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
• True Dual-Port SRAM (except ×18)
ARM Processor Support in ProASIC3 FPGAs
• M1 and M7 ProASIC3 Devices—Cortex-M1 and
CoreMP7 Soft Processor Available with or without
Debug

Specifications


Form,Package,Functional compatible component
Descriptions

Attribute Attribute Value
Manufacturer Microchip Technology
Product Category FPGAs (Field Programmable Gate Array)
Series ProASIC3
Package-Case 256-LBGA
Operating-Temperature  -55°C ~ 125°C (TJ)
Mounting-Type Surface Mount
Voltage-Supply  1.14 V ~ 1.575 V
Supplier-Device-Package 256-FBGA (17x17)
IC Number of Gates  1000000
Number-of-I-O 177 I/O
Number-of-LABs-CLBs  
Number-of-Logic-Elements-Cells   
Total-RAM-Bits  147456 Bit
Form,Package,Functional compatible component
Descriptions
IC FPGA 177 I/O 256FBGA

 

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